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Precautions when installing single-sided circuit board mold punching
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1 The blanking force mold design calculations, the size of the mold, closed height select press (including the type of tonnage).


2 start punching, each part of a comprehensive examination, including a clutch, brake, sliders, etc. are normal, whether operating mechanism **, never without even overshoot phenomenon.


3 die under the horn, usually two, grind the grinder must ensure Dies parallel, vertical. Horn placed leap home that does not interfere as much as possible while also blanking ** nearly die center.


4 To prepare several sets of T-shaped plate and screw head plate for use with the corresponding mold. Not touch the lower mold platen front straight wall. Between the contact surfaces should be abrasive pads, screws must be tightened.


5 When the installation should pay great attention to the mold on the lower die screws, nuts do not touch the mold (mold drop, closed).


6 die as manual adjustment, rather maneuver.


7 to improve the punching performance of the substrate, the substrate paper to be preheated. Its temperature to 70 ~ 90 ℃ as well.

 
 
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